Global Top 20 Companies Accounted for 75% of total Solder Paste Inspection (SPI) System market (QYResearch, 2021)

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Global Market Research Report
Solder Paste Inspection is mainly done to check
the solder paste deposits in the Printed Circuit
Board (PCB) manufacturing process. It is observed
that most of the solder joint defects in a PCB
assembly are because of improper solder paste
printing. With the help of solder paste
inspection (SPI), you can reduce the defects
related to soldering by a considerable
amount. Importance of Solder Paste Inspection
Process Here are some of the key points of
information, which prove the importance of SPI
process Improves PCB Quality Performance This
process makes use of advanced equipment for
precise inspection. Angle cameras are used to
take 3D pictures, which are very helpful in
measuring the alignment and volume of the solder
paste. This helps improve the yield, as well as
the print quality. Furthermore, it helps improve
the performance of the PCBs. Advanced Equipment
for Better Control Monitoring As said earlier,
angle cameras are used, which produce clear 3D
pictures. Unlike the traditional cameras, 3D
cameras are capable of capturing the height of
the solder paste printed. This facilitates
precise measurement of the solder paste volume.
Thus, with the help of SPI coupled with automated
optical inspection, manufacturers can easily
monitor and control the component placement and
solder paste printing processes.
According to the new market research report
Global Solder Paste Inspection (SPI) System
Market Report 2023-2029, published by
QYResearch, the global Solder Paste Inspection
(SPI) System market size is projected to reach
USD 0.46 billion by 2029, at a CAGR of 5.2
during the forecast period.
Copyright QYResearch global_at_qyresearch.com
www.qyresearch.com
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Global Market Research Report
Figure. Global Solder Paste Inspection (SPI)
System Market Size (US Million),
2018-2029 Global Market Size ( Mn)
2018
2022
2029
Based on or includes research from QYResearch
Global Solder Paste Inspection (SPI) System
Market Report 2023-2029.
Copyright QYResearch global_at_qyresearch.com
www.qyresearch.com
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Global Market Research Report
Figure. Global Solder Paste Inspection (SPI)
System Top 20 Players Ranking and Market
Share(Based on data of 2021, Continually
updated) Major Companies Ranking by Revenue Koh
Young Test Research, Inc (TRI) Sinic-Tek Vision
Technology Shenzhen ZhenHuaXing CKD
Corporation MIRTEC CO., LTD. CyberOptics
Corporation SAKI Corporation ASC
International MEK Marantz Electronics PARMI Corp
Mycronic (Vi TECHNOLOGY) Viscom AG ViTrox
Pemtron Caltex Scientific Jet Technology JUTZE
Intelligence Technology Shenzhen JT Automation
Equipment Shenzhen Chonvo Intelligence
Based on or includes research from QYResearch
2021 data information of Global Solder Paste
Inspection (SPI) System Market Report 2023-2029.
The global key manufacturers of Solder Paste
Inspection (SPI) System include Koh Young, Test
Research, Inc (TRI), Sinic-Tek Vision Technology,
Shenzhen ZhenHuaXing, CKD Corporation, MIRTEC
CO., LTD., CyberOptics Corporation, SAKI
Corporation, ASC International, MEK Marantz
Electronics, etc. In 2021, the global top 10
players had a share approximately 75.0 in terms
of revenue.
Copyright QYResearch global_at_qyresearch.com
www.qyresearch.com
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Global Market Research Report
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