Design for Testability is not a new concept – Vayoinfo

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Design for Ttestability
Intelligent DFx analysis
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Are you always willing to stay with those issues?

• Quality/reliability defects

No thermal consideration, leads to cold solder,
impact solder strength
Silkscreen cross brings build and rework risk
Stage Defects Remark
Design No thermal consideration Annual ring small Silkscreen error Silkscreen incomplete gt30 PCB design comes with problem.
Manufacturing Short Open Tombstone Cold solder Void gt60 defects could be found prior to build
Post-sales Solder joint crack Solder joint peeloff Repair rate for consumer product 537 in initial 3 years
Nonwetting
Tombstone
Bridge
Void
Via is too close to parts, it leads to poor
solder joint, impact solder joint strength
Crack risk
IPC research 80 defects could be found and
resolved at NPI stage.
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Change from DFx
Past
Yesterday
Today
Vayo customer solved this issue. Ex.
Venture/SurfaceArt/Sierra/Sandisk
They may still happen at your side.
Above issues puzzles most of us.
Vayo DFx software help you detect defects from
the initial beginning.
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Company introduction

• Founded on Jan of 2005, headquarter in
  China/Shanghai
• Dedicates to intelligent NPI software to
  accelerate design to manufacturing
• Fully in-house development, owns copyrights and
  patents
• Product installed gt20 countries and regions
  worldwide
• Strategy partnership with equipment and EDA
  provider Keysight/ViTrox/TRI/Fuji/Panasonic/Altiu
  m

gt10 years dedication on NPI technology brings up
the world-class product.
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Why DFx predict/solve process issue
IPC research 80 defects could be found and
resolved at NPI stage.

• Predict defect opportunity, increase
  manufacturing quality and reduce cost

With DFx consideration Increase process
difficulty steps rapid solder/assembly
defects increase rework rate and work loading
lower work efficiency and increase manufacturing
cost
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