Valor NPI - Help Identify Problems

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DFM Expert
Intelligent DFx analysis
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It happens around us whatever you notice or not
On year 2013, Hitachi elevator free fall due to
defected board in China, a lady was injured in
this event.
On year 2013, GM recall 380,000 vehicles due to
defected engine control board.
Due to abnormal behavior of PCBA, Taiwan high
speed train lost power on year 2013.
Major reason of AirAsia QZ8501 crash on year 2014
is a cracked solder joint on PCBA.
On year 2013, Chrysler recalled gt470,000 vehicles
due to defected board.
On year 2014, Mitsubishi recall 115,000 cars due
to defect board of light switch.
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Are you always willing to stay with those issues?

• Quality/reliability defects

No thermal consideration, leads to cold solder,
impact solder strength
Silkscreen cross brings build and rework risk
Stage Defects Remark
Design No thermal consideration Annual ring small Silkscreen error Silkscreen incomplete gt30 PCB design comes with problem.
Manufacturing Short Open Tombstone Cold solder Void gt60 defects could be found prior to build
Post-sales Solder joint crack Solder joint peeloff Repair rate for consumer product 537 in initial 3 years
Nonwetting
Tombstone
Bridge
Void
Via is too close to parts, it leads to poor
solder joint, impact solder joint strength
Crack risk
IPC research 80 defects could be found and
resolved at NPI stage.
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Change from DFx
Past
Yesterday
Today
Vayo customer solved this issue. Ex.
Venture/SurfaceArt/Sierra/Sandisk
They may still happen at your side.
Above issues puzzles most of us.
Vayo DFx software help you detect defects from
the initial beginning.
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