System in Package Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024 - PowerPoint PPT Presentation

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System in Package Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024

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System in package (SiP) is a module where numbers of integrated circuits are enclosed. It is typically used inside a mobile phone, digital music player, etc. to perform several functions of an electronic system. – PowerPoint PPT presentation

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Title: System in Package Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024


1
System in Package Market Global Scenario, Market
Size, Outlook, Trend and Forecast, 2015 2024
Bhavana Patel SEO Analyst help_at_variantmarketresea
rch.com
2
Description - System in Package Market
  • System in package (SiP) is a module where numbers
    of integrated circuits are enclosed.  It is
    typically used inside a mobile phone, digital
    music player, etc. to perform several functions
    of an electronic system. Higher functionality at
    minimum production costs and the growing demand
    for smaller electronics and mechanical devices
    has headed to the development of System in
    Package (SiP) solutions. SiP can be recognized by
    the horizontal tiling or vertical stacking of
    more than one related or unrelated bare die or
    packaged chips.
  • To Know More About This Report, Visit Here
    http//bit.ly/2rFV8DD

3
System in Package Market
4
System in Package Market
  • Major driving factors for this market are
    emergence of advanced and compact consumer
    electronic devices and conventional packaging
    cost of ICs like, packaging with the variation of
    sizes of the ICs. However, limited availability
    of resource skills is hampering the growth of
    the market. Growing demand of high performance
    electronic devices is creating future
    opportunities for the system in package market.

5
Top Manufactures
  • Jiangsu Changjiang Electronics Tech Co,
  • United Test and Assembly Center Ltd,
  • Automotive Service Excellence,
  • Siliconware Precision Industries,
  • Amkor Technology,
  • ChipSiP Technology,
  • ChipMOS Technology,
  • NANIUM, S.A,
  • Samsung Electro-Mechanics,
  • Octavo Systems among others.

6
Scope of System in Package Market
  • Packaging Technology Segments
  • 2D
  • 2.5D
  • 3D
  • Interconnection Technology Segments
  • Flip chip
  • Wire bond

7
Scope of System in Package Market
  • Type Segments
  • Surface mount technology (SMT)
  • Quad flat package (QFP)
  • Ball grid array (BGA)
  • Small outline package (SOP)
  • Application Segments
  • Communications
  • Medical
  • Automotive
  • Consumer electronics
  • Others

8
Scope of System in Package Market
  • Geographical Segments
  • North America
  • US
  • Canada
  • Mexico
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others

9
Scope of System in Package Market
  • Geographical Segments
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Others
  • RoW
  • South America
  • Middle East
  • Africa

10
Contact Us
  • VARIANT MARKET RESEARCH LLP?Web https//www.vari
    antmarketresearch.com
  • USA Office649 Mission St., 5th Floor, San
    Francisco, CA 94105, United States.Tel
    1-415-680-2785Fax 1-415-680-2786Email help_at_v
    ariantmarketresearch.com Orsales_at_
    variantmarketresearch.com
  • India Office (Corporate Headquarter)Office No.
    FL No.7, Prakash Developers, Survey no 34/A5,
    Wadgaon Sheri, Nagar Road, Pune 411014Tel 91
    20 65337795

11
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