VINNOVA Excellence Center Ubiquitous Intelligence in Paper and Package Short Introduction

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VINNOVA Excellence CenterUbiquitous
Intelligence in Paper and Package Short
Introduction
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Vision

• The Vinnova Excellent Center on Ubiquitous
  Intelligence in Paper and Packaging (VINNEX
  iPack) is
• A national hub of multidisciplinary collaboration
  for Researchers respectively from Swedish Forest
  Product Industry, Electronics Industry, and
  Bio-medical Industry jointly develop core
  competence and technologies towards smart paper
  and packaging.
• For example, integrating smart chips or
  bio-medical sensors, energy and battery cells,
  and wireless links/RFID on paper substrate, for
  applications such as Intelligent Food
  Pharmaceutical Packaging, Wearable Wireless
  Sensors and Intelligent Monitoring Devices for
  Healthcare, dissolvable smart dusts for security
  bio-defense.
• The center will perform both long-term innovative
  projects on key enabling technologies as well as
  application-oriented prototyping projects timely
  transfer IPs and know-how to its industrial
  partners.
• The center is guided by the vision of Ubiquitous
  Intelligence the next economic driving force
  after internet.

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System Concept and Application Examples
Radio/RFID ultra low cost (a few cents), ultra
low power (uW) Energy supply self-power via
wireless charge, printable battery etc Sensors
Silicon MEMS based or paper-based bio- medical
sensors Integration printable antenna, printale
sensors, low cost integration Applications Smart
Package, Healthcare, Home Security, Bio-Defense
etc
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Meet Multidisciplinary Industrial Partners
Find Innovative Business Opportunities
We bring the whole supply chain in one center !
Smart Paper Packaging
Werable Bio-Medical Sensors Bio-Paper
Bio-defense, Green PCB market
Niche Applications
VINNEX Center System Integration Technology
Fusion
Competence on Sensor Battery
Competence on Printing, Assembly, Manufacturing
Technologies
Competence on RFID/Electronics
Competence on Paper Board Paper Surface
Treatment
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Enabling Technologies
Technology
Paper and Surface
Information visualize
Sensor micro-fluids
Energy cells
Radio Antenna
Assembly Integration
Signal Processing
Application
RFID
Wireless sensor
Intelligent packaging
iLogistics
Health care
Home Security
Bio-defense
Extremely high relevance
High relevance
Relevance
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Research Methods

• Specification of requirement (mechanical and
  chemical stability, surface and electrical
  properties) of paper board for electronics
  applications
• Paper surface treatment (roughness, ink affinity,
  lateral diffusion etc) which enables high quality
  electronics printing and wet chemical process
• Conductive (e.g. nano-silvers) film, polymers,
  semiconductors, and functional materials printing
  on paper using inkjet technologies and chemical
  vapor deposition, coating each
• Characterization of electrical and mechanical
  properties, exploring process limitations for
  mass production and manufacturability. Feed-back
  to paper fab and process
• Passive components and sensor manufacturing and
  test, multi-layered structure and components
  testing
• Integration of interconnected paper board with
  silicon chips and sensors for intelligent
  packaging (RFID/chip design should starts in
  parallel with paper board processing).
  Reliability and function test.
• Production and manufacturability test for
  intelligent packaging, feed-back to paper board
  suppliers and process developers
• Demonstration of intelligent paper and packaging
  (integrate the technologies from the whole supply
  chain)

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Industrial Contributions

• Direct contributions
• (i.e. direct funding, donations of lab
  equipment and lab materials, host student
  internship, support of MPW chip, offer
  experimental materials and test, funding
  IPs/patents, scholarship to postdoc or Ph.D.
  researchers, industrial Ph.D. etc)
• In kind contributions (soft-money)
• i.e. your personnel participating in
  projects, equipment, open research positions for
  visiting researchers, industry PhD candidates,
  access to facilities etc, industrial supervisors
  for Ph.D. students and exjobb students, join
  steering board