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Extending and Expanding Moores Law Challenges and Opportunities

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Benefits of custom design (performance, density) will diminish. 16. Technology Outlook ... will be part of the design. Dynamically self-test, detect errors, ... – PowerPoint PPT presentation

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Title: Extending and Expanding Moores Law Challenges and Opportunities


1
Extending and Expanding Moores LawChallenges
and Opportunities
  • Shekhar Borkar
  • Intel Corp.
  • Aug 29, 2006

2
Outline
  • Todays challenge Power
  • Evolution of Multieverywhere
  • Whats beyond Multi?
  • Future challenges variations and reliability
  • Resiliency
  • Summary

3
Goal 10 TIPS by 2015
Pentium 4 Architecture
Pentium Pro Architecture
Pentium Architecture
486
386
286
8086
4
Power is the Challenge!
)
1400
2
SiO2 Lkg
10 mm Die
1200
SD Lkg
Active
1000
800
Power (W), Power Density (W/cm
600
400
200
0
90nm
65nm
45nm
32nm
22nm
16nm
5
Near Term Solutions
  • Move away from Frequency alone to deliver
    performance
  • More on-die memory
  • Multi-everywhere
  • Multi-threading
  • Chip level multi-processing
  • Throughput oriented designs
  • Valued performance by higher level of integration
  • Monolithic Polylithic

6
mArchitecture Techniques
7
Multi-Core
Power
Power 1/4
4
Performance
Performance 1/2
3
2
2
1
1
1
1
4
4
Multi-Core Power efficient Better power and
thermal management
3
3
2
2
1
1
8
Sources of Variations
9
Impact of Static Variations
Today
1.4
Frequency 30 Leakage Power 5-10X
30
1.3
1.2
130nm
Normalized Frequency
1.1
1.0
5X
0.9
1
2
3
4
5
Normalized Leakage (Isb)
10
Todays Freelance Layout
No layout restrictions
11
Transistor Orientation Restrictions
Transistor orientation restricted to improve
manufacturing control
12
Transistor Width Quantization
Vdd
Vdd
Op
Ip
Op
Vss
Vss
13
Todays Unrestricted Routing
14
Future Metal Restrictions
15
Implications to Design
  • Design fabric will be Regular
  • Will look like Sea-of-transistors interconnected
    with regular interconnect fabric
  • Shift in the design efficiency metric
  • From Transistor Density to Balanced Design
  • Interconnect RC not a major issue
  • Benefits of custom design (performance, density)
    will diminish

16
Technology Outlook
17
Reliability
18
Implications to Reliability
  • Extreme variations (Static Dynamic) will result
    in unreliable components
  • Impossible to design reliable system as we know
    today
  • Transient errors (Soft Errors)
  • Gradual errors (Variations)
  • Time dependent (Degradation)

Reliable systems with unreliable components
Resilient mArchitectures
19
Implications to Test
  • One-time-factory testing will be out
  • Burn-in to catch chip infant-mortality will not
    be practical
  • Test HW will be part of the design
  • Dynamically self-test, detect errors,
    reconfigure, adapt

20
In a Nut-shell
Yet, deliver high performance in the power cost
envelope
21
Summary
  • Moores Law is alive and well
  • Multi is the key solution
  • Many and too many cores, longer term
  • Not just for power and performance
  • But to deliver highest performance in the power
    envelope with resiliency
  • Reliable Systems
  • with
  • Unreliable Components
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