SUPERIOR FLUX

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SUPERIOR FLUX MFG. ELECTRONICS PRODUCTS

• Superior Flux Mfg. Co. founded in 1932.
• 1949 introduced Superior Supersafe No. 30, first
  Battelle formula flux.
• 1995 introduced SyberGelTM and SyberLiquidTM for
  repair/rework and hand-soldering.

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PRODUCT LINE

• Solder Pastes
• Tacky Fluxes
• Wave Solder Fluxes
• Component Tinning Fluxes
• Wire Tinning Fluxes
• Hand Solder Fluxes
• Copper and Nickel Pre-Cleaners
• Saponifier
• Descaler
• Dross Reduction Powder

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SOLDER PASTE

• 3000 Series Conventional No-Clean
• 4000 Series Synthetic, Low-Residue No-Clean
• 8000 Series Water-Soluble
• 9000 Series Rosin Mildly Activated (RMA)
• Solders 63Sn/37Pb
• 62Sn/36Pb/2Ag
• Lead-Free

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3000 SERIES NO-CLEAN SOLDER PASTE

• Classification IPC ANSI-J-STD 004, Type ROL0
• Meets and exceeds Bellcore standards.
• Pin-testable post-solder joints.
• Translucent residue.
• Capable of printing 12 mil pitch.

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4000 SERIES SYNTHETIC NO-CLEAN SOLDER PASTE

• Classification IPC ANSI J-STD-004,
• Type REL0.
• Meets and exceeds Bellcore standards.
• Translucent, protective post-solder residue.
• Pin-testable post-solder joints. General residue
  levels of 2.5 3.3. In proper conditions, can
  be as low as 1.1.
• Capable of printing 12 mil pitch.

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8000 SERIES WATER-SOLUBLE SOLDER PASTE

• Passes Bellcore
• Passes IPC
• Residues are truly water-soluble.
• Post-reflow residues can be left on boards for
  extended time and NOT reduce SIR values.
• Post-solder residues do not foam in aqueous
  cleaning systems.
• Capable of printing 12 mil pitch.

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9000 SERIES RMA SOLDER PASTE

• Exceptional reflow profiling characteristics.
• Capable of printing 16 mil pitch.
• Superior wetting characteristics.
• Residues can be aqueous cleaned using SyberKleen
  2000 Saponifier.

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RECOMMENDED REFLOW PROFILE 63Sn/37Pb and
62Sn/36Pb/2Ag
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REFLOW PROFILE FOR LEAD-Free
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APPLICATION METHODS

• Screen printing
• Cartridge printing
• Dispensing

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WHAT SETS SUPERIOR SOLDER PASTES APART?

1. All are non-halide.
2. All have a minimum 12 hour open-time between
   printing, placement, and reflow.
3. All are formulated for high-speed dispensing.
4. All No-Clean and RMA pastes can be aqueous
   cleaned in Superior SyberKleen 2000 Saponifier .
5. NO slumping.
6. NO tomb-stoning when stencil and reflow profile
   are properly set.
7. NO white residues on PCBs.

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WHAT SETS SUPERIOR SOLDER PASTES APART? (cont.)

1. Consistent rheology, thixotropy, and viscosity
   from lot-to-lot.
2. Consistent, clear, pin-testable residues with all
   No-Cleans.
3. Consistent metal-load due to no pre-thinning or
   post-thinning manufacturing process.
4. 4000 Series Synthetic No-Clean residues act as
   protective barrier against humidity and outside
   elements.
5. 8000 Series Water-Soluble residues can be washed
   any time after reflow. SIR values remain the
   same when PCBs are cleaned three (3) minutes or
   three (3) days after reflow.

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SOLDER PASTE STORAGE

• Shelf life for all solder pastes extended
• with freezer-storage first formulations.
• Freezer Storage (0ºC and below) 9-12 months.
• Refrigerator Storage (1-12ºC) 3-9
  months.
• Room temperature storage (18-23ºC) 3 months.

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TACKY FLUXES

• 4000 Synthetic No-Clean
• 3000 Conventional No-Clean
• 8000 Water-Soluble
• 9500 High Temperature
• Applications
• BGA Attachment and Repair
• Custom manufacturing applications
• Dispensable applications
• Preform soldering

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WAVE SOLDERING FLUXES

• Flux-types
• No-Clean
• Water-Soluble
• RMA
• Flux-base
• VOC-FREE
• Alcohol-based
• Applications
• 63Sn/37Pb, LEAD-Free.

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WAVE SOLDERING FLUX APPLICATION METHODS

• Spray
• Foam
• Drag
• Wave

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NO-CLEAN WAVE SOLDERING FLUXES

• VOC-Free
• No. 420 (Spray or Foam)
• No. 425
• Alcohol-based
• No. 312
• No. 315
• No. 340
• RFE 14Y3N
• All No-Clean fluxes classified as
• IPC ANSI J-STD 004 Type ORL0

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WATER-SOLUBLE WAVE SOLDER FLUXES

• Alcohol-based
• No. 84
• RFE 301-26C
• VOC-Free
• No. 32
• All Water-Soluble fluxes classified as
• IPC ANSI J-STD 004 Type ORM1

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ROSIN FLUXES

• Type R No. 97
• Type RMA No. 99
• Type RA No.100
• Hi-Temp RA No. 100HT
• Solids content variations are available
• for all fluxes.

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ADDITIONAL PCB ASSEMBLY PROCESS PRODUCTS

• SyberGelTM and SyberLiquidTM
• Hand solder, repair and rework gel or liquid that
  act as flux and cleaner.
• Superior SyberKleen 2000 Saponifier
• Rosin residue removal in aqueous cleaning
  systems.
• Superior Descaler
• A descaling solution for removing residual
  build-up that is standard for in-line and batch
  aqueous cleaners.
• Superior Dross Reducer
• Powder for dross and oxidation removal from
  solder bath to extend solder life.

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COMPONENT TINNING PRECLEANERS FLUXES

• Lead tinning for semiconductor, component, and
  fuse leads.
• Fluxes formulated for Tin/Lead,
  Lead-Free, and fusible alloys.
• Base Metals
• Copper
• Nickel
• Alloy 42
• Alloy 51
• Kovar
• Other specialty alloys

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SEMICONDUCTOR AND COMPONENT LEAD PRE-CLEANERS

• Copper Pre-Cleaner
• VOC-Free, non-hazardous, OA formulation.
• Light, pink color that changes if pH exceeds a
  3.5 reading.
• Nickel Pre-Cleaner
• A high activity nickel cleaner that contains no
  sulfuric acid.

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DIFFERENT FLUXES FOR DIFFERENT APPLICATIONS

• VOC-FREE, HALIDE
• No. 30, No. 30DS, No. 40MM4, No. 43
• ALCOHOL-BASED HALIDE
• No. 45, No. 48, No. 48S
• VOC-FREE, NON-HALIDE
• 430 Series
• ALCOHOL-BASED, NON-HALIDE
• No. 435, No. 435 31, No. 91

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WIRE TINNING FLUXES

• No-Clean Small gage (14-22) automatic or manual
  cut/strip/tin operations.
• VOC-Free No. 425
• Alcohol-based No. 325, No. 334.
• Water-soluble Large gage (2-12) wires Copper
  and brass crimped terminal wires.
• VOC-Free No. 30
• Alcohol-based No. 45
• Applications
• Automotive, Industrial, and Appliances.