Design and Fabrication of a 4H SiC Betavoltaic Cell M.V.S. Chandrashekhar, C.I. Thomas, Hui Li, M.G. Spencer and Amit Lal Advanced Materials and Devices Applications (AMDA) Department of Electrical and Computer Engineering Cornell University, - PowerPoint PPT Presentation

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Design and Fabrication of a 4H SiC Betavoltaic Cell M.V.S. Chandrashekhar, C.I. Thomas, Hui Li, M.G. Spencer and Amit Lal Advanced Materials and Devices Applications (AMDA) Department of Electrical and Computer Engineering Cornell University,

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Design and Fabrication of a 4H SiC Betavoltaic Cell M.V.S. Chandrashekhar, C.I. Thomas, Hui Li, M.G. Spencer and Amit Lal Advanced Materials and Devices Applications ... – PowerPoint PPT presentation

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Title: Design and Fabrication of a 4H SiC Betavoltaic Cell M.V.S. Chandrashekhar, C.I. Thomas, Hui Li, M.G. Spencer and Amit Lal Advanced Materials and Devices Applications (AMDA) Department of Electrical and Computer Engineering Cornell University,


1
Design and Fabrication of a 4H SiC Betavoltaic
CellM.V.S. Chandrashekhar, C.I. Thomas, Hui
Li, M.G. Spencer and Amit LalAdvanced
Materials and Devices Applications (AMDA)
Department of Electrical and Computer
EngineeringCornell University, Ithaca, NY
14850, USA
2
Presentation Outline
  • Motivation
  • Review theory of betavoltaic cell
  • Potential loss mechanisms
  • Comparison of materials options and predicted
    efficiencies
  • Results to date
  • Conclusion

3
Beta-Voltaic Battery
4
Motivation
  • Long half lives of ß-radiation sources.
  • Low energy sources are relatively benign
  • Small penetration depths
  • Significant power density in source

5
Applications
  • Low accessibility sensor nodes
  • On-chip power source for MEMS
  • Standby power for cell-phones
  • Pacemaker power supply

6
Basic Operation
High energy ?-particle E0
Optical /Acoustic phonons
e-
e-
e-
Optical/Acoustic phonons
Recombination
Ec
EFn
EFp
Recombination
Ev
e-
Dp
Dn
7
Comparison with AA Battery
8
Interaction of Hot Electrons with Semiconductors
  • Electron-hole pairs
  • Secondary electrons
  • Backscattered electrons
  • Elastic scattering
  • Acoustic phonons 50meV
  • Optical Phonons 100meV

From Klein. C.A. JAP 39 p.2029
9
Energy Bookkeeping
  • Important energy loss mechanisms accounted for by
    defining effective e-h pair creation energy
  • EEgltEkgtltERgt
  • E 8.4eV for 4H SiC- energy independent
  • Backscattering losses accounted for by
    subtracting percentage ? from incident electron
    energy E0
  • Carrier multiplication achieved (1-?)E0/E

10
Beta-voltaic Operation
VocnkT/q ln(Isc/Isat)
11
Prediction for Mature MaterialsOpen Circuit
Voltage Tritium 1
1. Backscattering and fill factor effects
included with 100 CCE.
12
Prediction for Mature MaterialsEfficiency
Tritium 1
1. Backscattering and fill factor effects
included with 100 CCE.
13
Prediction for Mature MaterialsPower Density
Tritium
14
Why SiC ?
  • Property
  • Band gap (eV)
  • Breakdown field for 1017cm-3 (MV/cm)
  • Saturated Electron Drift (cm/s)
  • Electron mobility (cm2/Vs)
  • Hole mobility (cm2/Vs)
  • Thermal Conductivity (W/cmK)

Si 1.1 0.6 107 1350 450 1.5
GaAs 1.42 0.65 1x107 6000 330 0.46
4H-SiC 3.2 3-5 2x107 lt900 lt120 4.9
3C-SiC 2.36 1.5 2.5x107 lt800 lt320 5.0
GaN 3.4 3.5 1.5x107 1000 300 1.3
6H-SiC 3.0 3-5 2.5x107 lt400 lt90 4.9
  • SiC Beta Voltaic Cell are promising for nano-watt
    power generation

High electric breakdown field High saturated
electron velocity High thermal conductivity
Suited for high temperature, high power, high
frequency, high radiation environment
15
4H SiC as Cell Material
  • 4H SiC is ideal material owing to its large
    bandgap (3.3eV)
  • Low realizable leakage current-substrates
  • 4H SiC is extremely radiation hard
  • Low Z-elements
  • Minimal loss from backscattering.
  • Significant progress in SiC radiation detectors
    with charge collection efficiencies (CCE) close
    to 100.

16
Betavoltaic Cell Design Considerations
  • Absorption depth of electrons
  • Bethe range E01.6 3µm_at_17keV
  • Determines junction width and depth
  • Backscattering of electrons from high Z-contact
  • Self absorption in source
  • Not considered here

17
Materials are grown at Cornell in a VEECO D180
SiC rotating disc multi-wafer reactor
  • Growth Temperature-1600C
  • Rotation-1000 rpm
  • Growth Pressure 50-300 torr

18
4H SiC Deep Junction PN Diode I-V Characteristics
  • Junction depth is 0.5 µm.
  • J010-17A/cm2, n2
  • J010-24A/cm2 with n2 available
    commercially-achievable.

19
Evaluation of Radiation Cell in SEM
  • 17 kV electron beam to simulate Ni-63 source
  • Magnification changes current density
  • Lowest incident current density 0.3 nA/cm2.
  • higher than Ni-63 source - 6 pA/cm2
  • comparable to tritium source 2 nA/cm2

20
Collection of Charge
  • Efficiency up to 14 for high current density
    with no edge recombination

21
Irradiation with Ni-63
22
Irradiation with Ni-63
  • Power conversion efficiency of 6 and Voc0.72V
  • Limited by fill factor and edge recombination.
  • Better fill factor 75 at higher
    currents-contacts
  • Equivalent corrected efficiency 15- approaches
    predicted value.
  • Enhanced current multiplication compared to
    monochromatic electron illumination 2400
  • Ni-63 irradiated output stable after ten days of
    continuous monitoring.

23
Irradiation with Tritium
  • Under Tritium illumination Jsc 1.2 µA/cm2
    observed in deeper junction 0.5 µm
  • 96 µA/Ci vs 20 µA/Ci in Si
  • Voc 1V vs lt0.1V in Si
  • Unpassivated efficiency of 10 vs 0.22 in Si
  • Estimated power 1 µW/cm2
  • New shallow junction 0.25 µm expected to show
    unpassivated efficiency of 20 with power
    density of 2 µW/cm2-useful!

24
Top view
Tritiated water
Thin p type diffused contact layer
2x radiation penetration depth
n- epitaxial layer
25
Conclusion
  • Efficiency of 6 demonstrated for shallow
    junction under Ni-63 illumination.
  • Highest efficiency of 10 and power density 1.0
    µW/cm2 observed under Tritium illumination.
  • Efficiency limited by edge recombination and poor
    fill factor from poor contacts
  • Can scale to 0.4 mW/cm2 for single layer by
    utilizing high aspect ratio structures.
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