All about eBeam Initiative


1
(No Transcript)
2
SAN JOSE CALIF. February 24 2009
20 Electronics Industry Leaders Collaborate to
Accelerate Development and Adoption of Design for
E-Beam Technology.
eBeam Initiative Aims to Increase Design Starts
and Reduce Time-to-market in Semiconductor Indust
ry
3
Mission The Initiative provides a forum for educ
ational and promotional activities regarding a
new design-to-manufacturing approach known as
Design for e-beam (DFEB) that reduces mask costs
for semiconductor devices.
4
Technology DFEB is a design and software approac
h to enhance the throughput of e-beam
lithographic exposure. DFEB uses character or
cell projection (CP) technology combined with
design and software techniques to reduce a
designs required shot count.
This results in increased CP e-beam direct-write
(EbDW) throughput.
5
Applications Systems companies seeking all-layer
custom SoC prototypes low-to-mid-volume
semiconductor companies producing maskless test
chips engineering samples and derivative chips
and supercomputing applications.
6
Design Team Advisors Provide business and techni
cal insights and requirements to the Steering
Group Ecosystem members.
Martin Deneroff Director of Engineering D. E.
Shaw Research (DESRES) Martin Deneroff heads the
Engineering subgroup at DESRES. With over thirty
years of experience in the electronics industry
he is an expert in computer system architecture
and development.
Jack HardingChairman President CEO eSilicon
Corporation Jack Harding is responsible for eSil
icons overall leadership strategy and
management. Mr. Harding brings more than 25 years
of management experience in the semiconductor
industry spanning the EDA and IC sectors.
7
Design Team Advisors Provide business and techni
cal insights and requirements to the Steering
Group Ecosystem members.
Colin Harris Chief Operating Officer PMC-Sierra
Colin Harris is responsible for all aspects of w
orldwide manufacturing including supplier
relationships product testing and assembly. He
also oversees quality and reliability product
engineering information technology and design
services.
Riko Radojcic Principal Engineer Manager
Qualcomm Riko Radojcic is a leader of Design-for
-Technology initiatives at Qualcomm CDMA
Technologies-addressing design for 3D
integration manufacturability and variability
methodologies at polygon circuit logic and
system design levels.
8
Design Team Advisors Provide business and techni
cal insights and requirements to the Steering
Group Ecosystem members.
Jean-Pierre Geronimi CAD Director
STMicroelectronics Jean-Pierre Geronimi is CAD d
irector at STMicroelectronics. Mr. Geronimi
graduated from INPG Grenoble in electrical
engineering and computer science. He has more
than 20 years of experience in design automation
and VLSI implementation.