Title: DuPont polyimide paste resistors and capacitors
1 NIST AEPT Material Evaluations at Merix
- DuPont polyimide paste resistors and capacitors
- DuPont Cast-on-Copper capacitor laminate
- Ormet sintered paste resistors
- 3M C-Ply capacitor laminate
- MacDermid M-Pass Ni/P plated resistors
- Gould TCR NiCr resistor foil
- DuPont ceramic resistors
23M C-Ply Projects
- 3M C-Ply used to build boards for
- NIST Advanced Embedded Passives Technology
(AEPT) consortium test boards. - Sun Microsystems test boards.
- Prototypes for other OEMs
- Nortel Emulator board (also includes a buried
resistor layer) for the AEPT project. - UL qualification boards for 3M
33M C-Ply Projects AEPT Test Boards
- TV1-C Testing
- Temperature/humidity
- Thermal cycle
- Thermal shock
- ESD
- Other testing
- Pictorial view of the TV-1 Capacitor Design.
- 80 X 0.170 sq. Capacitors
- 6 X 0.60 sq. Capacitors
- 5 X NIST Capacitor patterns
- 3 X Daisy chain array capacitors
43M C-Ply Projects Sun Microsystems Test Boards
- Sun Test Board
- 20 Layers
- 4 C-Ply cores
- Microvias
- Provided impedance and EMI data
- Also built with 1 mil FR4.
C-Ply cores separated by regular core.
53M C-Ply Projects Nortel Emulator Board
- Nortel Emulator Board
- 14 Layers
- 4 C-Ply cores
- 1 Embedded resistor layer
- Microvias
- Emulates existing high-speed board with buried
components.
63M C-Ply Projects Prototypes for other OEMs
Single C-Ply core in center.
Adjacent C-Ply cores.
7Equipment Modifications for Thin Core Processing
- Pre-Clean improved thin core capability
- Laminator equipment has thin core capability.
- Print no major changes.
- DES improved thin core capability.
- Hi-Pot test individual images.
- PEP careful handling.
- AOI no major changes.
- Press careful handling.
- Electrical Test allow for capacitor charging.
8Thin Core Volumes Yields
- We have processed 1600 ft2 of C-Ply to date.
- Yield issues include
- Handling Damage.
- Hi-Pot Failure.
- Registration related to scaling.
- Power to Ground Shorts.
- Yields have steadily improved.
9Thin Core Lessons Learned
- Equipment with thin core capability is vital.
- Training in thin core handling is key.
- Subpart construction may be required.
10Standard Two-Sided Etching
- Border Modifications
- No overlapping etched features.
- Full copper out to panel edge.
- No overlapping innerlayer vents.
- Potential Problems
- Laminate tearing along edge.
- Particle generation.
- Loss of tooling hole integrity.
11Thin Core Subpart Construction
- Process Modifications
- No border modifications required.
- Image and etch first side of material.
- Laminate into a subpart.
- Image and etch second side of material.
- Potential Problems
- Registration of second side image to first side.
- Subpart registration to parent part.
- Subparts are more prone to epoxy spots that can
create shorts.
12UL Qualification
- UL qualification
- 3M has 94V-0, 130C RTI laminate qualification.
- Merix has 94V-0, 130C MOT board level
qualification for C-Ply with FR4.
13MacDermid M-Pass Ni/P Plated Resistor
- Deposition process routinely operational in
Waterbury - Current lower size limit 20 mils
- Demonstrated resistivity 25 to 100 Ohms/square
14Selective Plate Process for Ni/P Resistor
15NIST AEPT TV2-R Test Boards
MacDermid M-Pass Ni/P Plated Resistor
- MacDermid M-Pass used to build boards for
- NIST AEPT consortium test boards.
- Nortel Emulator board
- CALCE consortium test boards.
Pair of resistors on Nortel emulator
16Gould TCR NiCr Resistor Foil
- Two-step etch process
- Current lower size limit 20 mils, /-15
tolerance - Resistance demonstrated 25 to 250 Ohms/square
10 mil resistors
17Gould TCR NiCr Resistor Process
18NIST AEPT TV1-R Test Boards Resistor sizes range
from 0.005 to 0.055 squares.
Gould TCR NiCr Resistor Foil
- Gould TCR used to build boards for
- NIST AEPT consortium test boards.
- 22-layer prototype for OEM.
- CALCE consortium test boards.
19Gould TCR NiCr Resistor Foil Variation TV1-R
Predicted vs. Actual
- Summary of resistor data for NIST AEPT TV1-R test
boards based on 10 boards (approximately 6,660
resistors).
20Projected Yield (Centered on Target)
20 mil resistor data compared to a target of 60
ohms , /- 15 tolerance. The predicted yield is
greater than 99.
21Projected Yield (Not Centered on Target)
20 mil resistor data compared to a target of 50
ohms, /- 15 tolerance. The predicted yield is
only 10.
22Process Challenges for Embedded Resistors
- Conformance of the dry-film photoresist over the
etched circuitry. - Registration of the resistors to the etched
circuitry. - Thin core handling through outerlayer processes.
- Alkaline etch tends to attack polymer dry-film
photoresists.