DuPont polyimide paste resistors and capacitors - PowerPoint PPT Presentation

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DuPont polyimide paste resistors and capacitors

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NIST Advanced Embedded Passives Technology (AEPT) consortium test boards. ... Emulates existing high-speed board with buried components. ... – PowerPoint PPT presentation

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Title: DuPont polyimide paste resistors and capacitors


1
NIST AEPT Material Evaluations at Merix
  • DuPont polyimide paste resistors and capacitors
  • DuPont Cast-on-Copper capacitor laminate
  • Ormet sintered paste resistors
  • 3M C-Ply capacitor laminate
  • MacDermid M-Pass Ni/P plated resistors
  • Gould TCR NiCr resistor foil
  • DuPont ceramic resistors

2
3M C-Ply Projects
  • 3M C-Ply used to build boards for
  • NIST Advanced Embedded Passives Technology
    (AEPT) consortium test boards.
  • Sun Microsystems test boards.
  • Prototypes for other OEMs
  • Nortel Emulator board (also includes a buried
    resistor layer) for the AEPT project.
  • UL qualification boards for 3M

3
3M C-Ply Projects AEPT Test Boards
  • TV1-C Testing
  • Temperature/humidity
  • Thermal cycle
  • Thermal shock
  • ESD
  • Other testing
  • Pictorial view of the TV-1 Capacitor Design.
  • 80 X 0.170 sq. Capacitors
  • 6 X 0.60 sq. Capacitors
  • 5 X NIST Capacitor patterns
  • 3 X Daisy chain array capacitors

4
3M C-Ply Projects Sun Microsystems Test Boards
  • Sun Test Board
  • 20 Layers
  • 4 C-Ply cores
  • Microvias
  • Provided impedance and EMI data
  • Also built with 1 mil FR4.

C-Ply cores separated by regular core.
5
3M C-Ply Projects Nortel Emulator Board
  • Nortel Emulator Board
  • 14 Layers
  • 4 C-Ply cores
  • 1 Embedded resistor layer
  • Microvias
  • Emulates existing high-speed board with buried
    components.

6
3M C-Ply Projects Prototypes for other OEMs
Single C-Ply core in center.
Adjacent C-Ply cores.
7
Equipment Modifications for Thin Core Processing
  • Pre-Clean improved thin core capability
  • Laminator equipment has thin core capability.
  • Print no major changes.
  • DES improved thin core capability.
  • Hi-Pot test individual images.
  • PEP careful handling.
  • AOI no major changes.
  • Press careful handling.
  • Electrical Test allow for capacitor charging.

8
Thin Core Volumes Yields
  • We have processed 1600 ft2 of C-Ply to date.
  • Yield issues include
  • Handling Damage.
  • Hi-Pot Failure.
  • Registration related to scaling.
  • Power to Ground Shorts.
  • Yields have steadily improved.

9
Thin Core Lessons Learned
  • Equipment with thin core capability is vital.
  • Training in thin core handling is key.
  • Subpart construction may be required.

10
Standard Two-Sided Etching
  • Border Modifications
  • No overlapping etched features.
  • Full copper out to panel edge.
  • No overlapping innerlayer vents.
  • Potential Problems
  • Laminate tearing along edge.
  • Particle generation.
  • Loss of tooling hole integrity.

11
Thin Core Subpart Construction
  • Process Modifications
  • No border modifications required.
  • Image and etch first side of material.
  • Laminate into a subpart.
  • Image and etch second side of material.
  • Potential Problems
  • Registration of second side image to first side.
  • Subpart registration to parent part.
  • Subparts are more prone to epoxy spots that can
    create shorts.

12
UL Qualification
  • UL qualification
  • 3M has 94V-0, 130C RTI laminate qualification.
  • Merix has 94V-0, 130C MOT board level
    qualification for C-Ply with FR4.

13
MacDermid M-Pass Ni/P Plated Resistor
  • Deposition process routinely operational in
    Waterbury
  • Current lower size limit 20 mils
  • Demonstrated resistivity 25 to 100 Ohms/square

14
Selective Plate Process for Ni/P Resistor
15
NIST AEPT TV2-R Test Boards
MacDermid M-Pass Ni/P Plated Resistor
  • MacDermid M-Pass used to build boards for
  • NIST AEPT consortium test boards.
  • Nortel Emulator board
  • CALCE consortium test boards.

Pair of resistors on Nortel emulator
16
Gould TCR NiCr Resistor Foil
  • Two-step etch process
  • Current lower size limit 20 mils, /-15
    tolerance
  • Resistance demonstrated 25 to 250 Ohms/square

10 mil resistors
17
Gould TCR NiCr Resistor Process
18
NIST AEPT TV1-R Test Boards Resistor sizes range
from 0.005 to 0.055 squares.
Gould TCR NiCr Resistor Foil
  • Gould TCR used to build boards for
  • NIST AEPT consortium test boards.
  • 22-layer prototype for OEM.
  • CALCE consortium test boards.

19
Gould TCR NiCr Resistor Foil Variation TV1-R
Predicted vs. Actual
  • Summary of resistor data for NIST AEPT TV1-R test
    boards based on 10 boards (approximately 6,660
    resistors).

20
Projected Yield (Centered on Target)
20 mil resistor data compared to a target of 60
ohms , /- 15 tolerance. The predicted yield is
greater than 99.
21
Projected Yield (Not Centered on Target)
20 mil resistor data compared to a target of 50
ohms, /- 15 tolerance. The predicted yield is
only 10.
22
Process Challenges for Embedded Resistors
  • Conformance of the dry-film photoresist over the
    etched circuitry.
  • Registration of the resistors to the etched
    circuitry.
  • Thin core handling through outerlayer processes.
  • Alkaline etch tends to attack polymer dry-film
    photoresists.
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