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Soft Errors in CAM and Their Impact On TLB Reliability

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... Write, What if there is a flip at T1 or T2. Flip at both circuit will search instead mismatch? ... Id : drain current induced by the ion, Tf : flipping time ... – PowerPoint PPT presentation

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Title: Soft Errors in CAM and Their Impact On TLB Reliability


1
Soft Errors in CAM and Their Impact On TLB
Reliability
  • Feihui Li
  • Swapna Dontharaju

2
Introduction
  • TLB - a small cache, to speed up address
    translation in processors with virtual memory
  • Soft errors can significantly affect memories
  • Because of spatial density, amount of information
    stored
  • We are studying their impact on CAMs
  • On the other hand, TLB is a major power consumer
  • STRONG ARM processor, 17 of total power
    consumption due to TLB though designed for low
    power, and TLB is very small
  • We have compared Soft Error Susceptibility in CAM
    designs that reduce the power consumption

3
Analyzing the Basic CAM cell
  • Write a 1(0)
  • Pass transistors T1, T2 opened via Word line
  • Bit set to 1, Bit to its inverse
  • T6(T5) conducting, T5(T6) not ? storage of 1
  • Search (1)
  • Match line precharged high
  • Search bit on Bit (1), its inverse on Bit (0)
  • If 1 at Q, T8 propagates 0 (from Bit) to gate
    of T9
  • T9 stays nonconducting, Matchline not
    discharged
  • Obvious Questions
  • During a Write, What if there is a flip at T1
    or T2
  • Flip at both circuit will search instead
    mismatch?
  • During a Search, If T7 / T8 flip will the
    result be correct?
  • If T9 flips, Match line discharges even if no
    search?
  • Strikes at T3, T4, T5, T6 Flip in the value
    stored?

4
In the TLB ..
  • A flip at any of the transistors connected to the
    match line can cause the match line, (even if
    search successful) to discharge.
  • So even if address translation was available in
    the TLB, the instruction could have missed the
    TLB! Performance, power penalty.

5
Designs studied
  • Basic CAM
  • Necessary to put all bit lines to 0, to
    precharge Match line high switching in bit
    lines
  • Modified CAM
  • Control line used, to precharge match line
    without putting to zero the bit lines reduces
    switching activity of bit lines.
  • Toggling Match Line CAM
  • CAM alternates between active high and active
    low match line output for every access reduces
    switching activity in match lines.

6
Charge Induction Scenarios for CMOS circuits
  • Cases II I Voltage at p node go up
  • Cases III IV Voltage at n node go down.
  • II IV wont affect logic state of circuit,
    node is already at logic value toward which
    injected charge will drive it
  • III I affect logic value of node, may cause
    incorrect operation of circuit, modeled below

Resistors ? conducting transistors, Rectangles
?drain Current sources show direction of current
flow
7
Experimental Setup
  • When a 1 is stored in the CAM cell, Cases III
    I modeled as,
  • Positive pulse at Q to induce a bit flip
  • Negative pulse at Q to induce a bit flip
  • Similar analysis when CAM cell stores a 0
  • Qcritical a measure of the current required
    to flip a memory cell
  • Qcritical of the nodes in the cell found Q,
    Q, T9.
  • Using Micro Magic and HSPICE, current spikes
    can only be injected at nodes, (transistors
    lumped by interconnect say Q, Q) rather than
    each individual transistors. Not possible to
    study some of the interesting flips mentioned
    above, in isolation.

8
Results
9
Results
  • Qcritical is different for each node
  • Qcritical depends highly on state of the cell
    precharge, read or write
  • Match line transistor T9 in Basic CAM, more
    susceptible to bit flip than other nodes

10
Analysis
A method to estimate Soft Error Rate (SER) using
Qcritical has been developed by Hazucha and
Svensson Nflux intensity of Neutron flux,
CS area of crossection of node, Qs charge
collection efficiency, Qcritical minimum charge
collected due to a particle strike that causes a
bit flip Id drain current induced by the ion,
Tf flipping time Qcritical has been used as an
index to the SER.
11
Work in progress..
  • We are working on the following -
  • Impact of technology scaling on SER of Basic
    CAM and TLB structure (180nm down to 70 nm)
  • For a given technology, see whether the Basic
    CAM or the 6T-SRAM is more susceptible to soft
    errors for a given row of the TLB, which of
    them contributes more to SER
  • Model Power consumption of a 16 word CAM, each
    word having 16 bits, using each of the above CAM
    cells
  • Study the Qcritical Vs Power consumption
    tradeoffs

12
Thank You !!
  • Questions

13
References
  • 1 Thirugnanam, G. Vijay Krishnan, N. Irwin,
    M.J.A novel low power CAM design, Proceedings
    of the 14th Annual IEEE International ASIC/SOC
    Conference, Sept. 2001, Page(s) 198 -202
  • 2 T.Juan, T.Lang and J.Navarro, Reducing TLB
    Power Requirements, Proceedings of the 1997
    International symposium on Low power electronics
    and design, 1997, pp. 196-201
  • 3 V. Degalahal, N. Vijay Krishnan, M.J Irwin,
    "Analyzing Soft Errors in Leakage Optimized SRAM
    Design", In the Proceedings of VLSI Design
    conference January 2003, New Delhi, India
  • 4 H Cha, J H Patel A logic level model for
    alpha particle hits in CMOS circuits Proceedings
    of the International Conference on Computer
    Design, 1993.
  • 5 P. Hazucha and C. Svensson, Impact of CMOS
    technology scaling on the atmospheric neutron
    soft error rate, IEEE Transactions on Nuclear
    Science, 2000
  • 6 D.C. Burger and T.M. Austin. The SimpleScalar
    tool-set, Version 2.0. Technical Report 1342,
    Dept. of Computer Science, UW, June 1997
  • 7 The SimpleScalar tool-set. http//www.simplesc
    alar.com/
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