Opportunities and Challenges for use of Nanotechnology in Microelectronic Packaging Nachiket Raravikar, Nirupama Chakrapani, Lakshmi Supriya and Vijay Wakharkar, Assembly and Test Technology Development, Technology Manufacturing Group, Intel

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Opportunities and Challenges for use of
Nanotechnology in Microelectronic
PackagingNachiket Raravikar, Nirupama
Chakrapani, Lakshmi Supriya and Vijay Wakharkar,
Assembly and Test Technology Development,
Technology Manufacturing Group, Intel
Corporation, Chandler, Arizona

• Rapid evolution of complex packaging
  architectures is ongoing, especially with the
  convergence of computing and communication
• Integrating materials is a major challenge
• Providing Innovative materials solutions is
  imperative
• Nanotechnology for packaging brings
• Significant Opportunities (multifunctionality,
  step change in properties, novel properties,
  etc.) Incremental Disruptive
• Unique Challenges/Issues Engage Resolve
• Nanotechnology its applications are still
  evolving immature major challenges still lie
  ahead in the areas such as metrologies,
  manipulation, predictive modeling at nanoscale,
  environmental concerns, etc.
• If exploited opportunistically - Nanotechnology
  can offer an alternative perspective / solution
  path to critical packaging problems

Poster no. 56