SSCS Sponsored Asian SolidState Circuits Conference ASSCC Status Update

1
SSCS SponsoredAsian Solid-State Circuits
Conference (A-SSCC)Status Update

• Compiled by Chorng-Kuang Wang (Chair, Steering
  Committee)
• Feb. 6, 2005

2
Conference Site
10F, Ambassador Hotel HsinchuAdd No.188, Chung
Hwa Road, Sec 2, Hsinchu 300, Taiwan, R.O.C.TEL
886-3-515-1111 http//www.ambh.com.tw/
3
(No Transcript)
4
A-SSCC 2005 Call for Papers
Call for Papers IEEE Asian Solid-State Circuits
Conference (A-SSCC) 2005
Location Ambassador Hotel, Hsinchu, Taiwan Date
November 1, 2005 (Tue.) November 3, 2005
(Thu.) Sponsored by IEEE SSCS, IEEE Seoul
Section, IEEE Tokyo Chapter, IEEE SSCS Taipei
Chapter and IEEE Taipei Section. In Cooperation
with Industrial Technology Research Institute
(ITRI) and Semiconductor Technology Academic
Research Center (STARC). Organized by National
Taiwan University, National Chiao Tung
University, National Tsing Hua University and
SoC Technology Center (STC/ITRI)
5
Contacts

• General Affairs
• Steering committee secretary Prof. Shen-Iuan Liu
  (lsi_at_cc.ee.ntu.edu.tw TEL [phone]/FAX
  886-2-23671909)
• A-SSCC official website http//a-sscc.org/
• Email webadm_at_A-SSCC.ee.ntu.edu.tw
• Conference 2005
• Conference secretary Prof. Shyh-Jye (Jerry) Jou
  (jerryjou_at_cc.nctu.edu.tw TEL [phone]/Fax
  886-3-5710580)
• TPC vice-chair Prof. Makoto Ikeda
  (ikeda_at_silicon.u-tokyo.ac.jp TEL [phone]
  and Fax [phone] )

6
Agenda

• I. A-SSCC Organization Structure
• II. Detail Plans for A-SSCC 2005
• III. Schedule for A-SSCC 2006

7
Agenda

• I. A-SSCC Organization Structure
• II. Detail Plans for A-SSCC 2005
• III. Schedule for A-SSCC 2006

8
I. A-SSCC Organization Structure

• agenda
• A-SSCC Features and Evolvement
• A-SSCC Organization Structure
• To Do Items

9
I. A-SSCC Organizational Structure

• agenda
• A-SSCC Features and Evolvement
• A-SSCC Organization Structure
• To Do Items

10
Conference Features

• SSCS advantages (subject to being approved)
• Special issue in IEEE JSSC
• High lights in ISSCC
• Repeat of ISSCC tutorial / short courses
• Asia advantages
• Low-power low-voltage CMOS circuits
• Memory circuits and relevant device technology
• Circuits and devices for handheld equipment and
  display
• Industry practical program
• Product based papers and presentations,
  specification and application, live demo,
  advanced state-of-art points, chip photo, chip
  architecture/software, circuit (not necessarily
  original, but improvements), characterization
  results and packaging/testing results.
• Rotational
• IEEE Region 10 (R10)
• Taiwan(2005), China(2006), Korea(2007)(planned),
  Japan, India and Singapore
• AP-ASIC held in China in 2006 will be replaced
  with the new conference (A-SSCC)

11
AP-ASIC Evolved to A-SSCC with Design Focus

• AP-ASIC SC Voting
• Ballot
• Evolving AP-ASIC to A-SSCC and FOLLOWING A-SSCC
  TECHNICAL FOCUS/VISION/ORGANIZING TO EXECUTE AND
  CARRY ON THE CONFERENCE STARTING 2006
• Results
• 12 yes out of 12 replied.
• 11 yes ballots received out of 12 ballots
  sent.
• AP-ASIC evolved to A-SSCC with circuit design
  focus
• AP-ASIC moved to Nov. and renamed as A-SSCC in
  2006
• The first A-SSCC will be in Taiwan 2005

12
AP-ASIC SC Voting Results
13
I. A-SSCC Organization Structure

• agenda
• A-SSCC Features and Evolvement
• A-SSCC Organization Structure
• To Do Items

14
Organization

• Industry participation and involvement
• particularly Japan, Korea and Taiwan
• A stable conference organization with
• SSCS involved
• distinguished SSCS researchers
• long term SSCS advisory
• TPC chair appointed by SSCS AdCom. Executive
  committee with certain members appointed by SSCS
• Multi-relationships (organizer, sponsor, support
  and cooperation)
• Local and international
• Associated with FSA and SIA
• Expanding/Merging with the existing and SSCS long
  time involved AP-ASIC

15
A-SSCC Organization Structure
AdCom Meeting Committee
Steering Committee with two international liaison
members
Liaison Members
Technical Program Committee
Conference
Organization Committee
Local
16
A-SSCC Organization Structure
AdCom Meeting Committee
International
Steering Committee with two international liaison
members
Liaison
Technical Program Committee
Conference
Organization Committee
Local
17
A-SSCC Organization Structure
AdCom Meeting Committee
Steering Committee Ck Wang, G. Hu, W. Sansen, A.
Chandrakasan, T. Sakurai, etc
Liaison W. Sansen, (Belgium) A. Chandrakasan,
(USA)
Technical Program Committee Takayasu Sakurai,
(Japan)
Conference Genda Hu, (Taiwan)
Organization Committee Chien-Wei Jen, (Taiwan)
Local
18
A-SSCC Organization Structure
AdCom Meeting Committee
International
Steering Committee Ck Wang, G. Hu, W. Sansen, A.
Chandrakasan, T. Sakurai, etc
Liaison W. Sansen, (Belgium) A. Chandrakasan,
(USA)
Technical Program Committee Takayasu Sakurai,
(Japan)
Conference Genda Hu, (Taiwan)
Organization Committee Chien-Wei Jen, (Taiwan)
Local
19
Forming Steering Committee

• Functions
• Suggest/Overlook conference technical directions
  and operations
• Recommend, vote and ratify chairs/co-chairs and
  structure of local conference and TPC
• Chair
• Appointed by AdCom
• Members
• Appointed by AdCom or recommended by SC
• Final list ratified by AdCom
• Two international liaison members

20
Steering Committee (Sept. 2004 - Aug. 2007)

• Chair Chorng-Kuang Wang, NTU, Taiwan
• Secretary Shen-Iuan Liu, NTU, Taiwan
• International Liaison Members
• Anantha Chandrakasan, MIT, USA
• Willy Sansen, KUL, Belgium
• Members
• Taiwan
• Nicky Lu, Etron Technology, Inc.
• Genda Hu, TSMC
• Jyuo-Min Shyu, ITRI
• Japan
• Kunihiro Asada, University of Tokyo
• Kiyoo Itoh, Hitachi Central Research
• Takayasu Sakurai, University of Tokyo
• Katzuhiro Shimohigashi, Semiconductor
• Technology Academic Research Center

• China
• Zhihua Wang, Tsinghua University
• Korea
• Deong-Kyoon Jeong, Seoul National
• University
• Sung Bae Park, Samsung Electronics
• Hoi-Jun Yoo, KAIST
• India
• Navakanta Bhat, Indian Institute of
• Science

21
Forming Conference/TPC Chairs/Co-Chairs

• Practical considerations
• Balance of countries/academic/industry
• Co-chair will the chair of next term
• TPC chair/co-chair criteria
• Visionary and knowledgeable
• Credential and influential
• SSCS involved and experienced
• Leadership
• Conference chair/co-chair
• Locally supported
• Leading figure
• Influential
• Process
• Candidates recommended by SC or appointed AdCom
• Voted by SC
• TPC chair - appointed by AdCom from the SC voting
  result
• Conference chair - ratified by AdCom from
  the SC voting result

22
Conference/TPC Chairs/Co-Chairs Plan
23
Conference/TPC Chairs/Co-Chairs 2005-2007
24
Action/To Do Items

• JSSC special issue request
• Possible requests
• ISSCC short courses/tutorials
• A-SSCC high light in ISSCC
• A-SSCC 2007 in Korea initialization (DONE)
• Conference TPC chairs/co-chairs 2006-2007
  finalized

25
Agenda

• I. A-SSCC Organization Structure
• II. Detail Plans for A-SSCC 2005
• III. Schedule for A-SSCC 2006

26
II. Detail Plans for A-SSCC 2005

• agenda
• Technical Program Committee
• Local Conference Structure
• Conference Schedule
• Financial Plan
• Working Items Schedule
• Issues Pending

27
II. Detail Plans for A-SSCC 2005

• agenda
• Technical Program Committee
• Local Conference Structure
• Conference Schedule
• Financial Plan
• Working Items Schedule
• Issues Pending

28
Technical Program Committee
29
Technical Programs

• Paper Sections
• Analog
• Wireless and Wireline Communication
• Digital
• Memory
• System-Level Integration
• Emerging Applications and Technologies
• Special Programs
• Industry Program
• Educational Program
• Invited Program

30
Special Programs

• Industrial Sessions
• Product base
• Spec and application info
• Live demo
• State-of-the-art points
• Chip photo
• Chip architecture/software
• Circuit (not necessarily original, but
  improvements)
• Characterization results
• Packaging/testing results
• Educational Program
• Tutorials/Short courses One each from Analog,
  Digital low-power and Memory
• Invited Program
• Keynote
• Invited
• Panel discussion
• Highlights of ISSCC 2005

31
II. Detail Plans for A-SSCC 2005

• agenda
• Technical Program Committee
• Local Conference Structure
• Conference Schedule
• Financial Plan
• Working Items Schedule
• Issues Pending

32
Local Conference Structure
33
II. Detail Plans for A-SSCC 2005

• agenda
• Technical Program Committee
• Local Conference Structure
• Conference Schedule and Site Layout
• Financial Plan
• Working Items Schedule
• Issues Pending

34
Conference Schedule (Tentative)
35
Conference Schedule (Tentative)
36
Conference Schedule Summary (Tentative)
37
Site Floor Layout
38
Site Floor Layout-Keynote Speech Invited Talks
39
Site Floor Layout- Parallel Oral Paper Sessions
40
II. Detail Plans for A-SSCC 2005

• agenda
• Technical Program Committee
• Local Conference Structure
• Conference Schedule
• Financial Plan
• Working Items Schedule
• Issues Pending

41
A-SSCC 2005 Finance Estimate
42
Conference Income Estimate
43
Conference Expense Estimate
44
Tutorial Budget Plan
45
II. Detail Plans for A-SSCC 2005

• agenda
• Technical Program Committee
• Local Conference Structure
• Conference Schedule
• Financial Plan
• Working Items Schedule
• Issues Pending

46
SC, TPC and Local Working Items
47
SC, TPC and Local Working Items Schedule (CFP)

• Working Items
• Date Tuesday-Thursday, November 1-3, 2005

Paper Submission deadline Tue. May 31, 2005 at
2000
Acceptance notification Fri. July 15, 2005
Final papers submission Thu. Sep 1,
2005 at 2000
Author registration Thu.
Sept. 1, 2005
Reduced rate advance by Fri. Sept. 30, 2005
Non-reduced rate On-site, after Fri. Sept. 30,
2005
48
SC, TPC and Local Working Items (internal)
Conference site reserve Oct. 1
Keynote, invited talk and tutorial speaker
invitation and confirmation Mar. 31
Website setting Nov. 30
MOE compensation apply Dec. 1
Call for paper (2nd call version) Apr. 25
Domain name apply Dec. 3
IEEE Taipei Section donation apply Dec. 5
Industry donation summary Apr. 30
LOGO design Dec. 10
Local organization meeting 2nd call Jan.
12
Local
Call for paper distribution(2nd) Apr. 30
Conference site contract Apr. 30
TPC
Paper submission system contract Jan. 20
Call for paper (1st call version) Jan. 20
Steering committee/ TPC/Local
Call for paper (Distribution) Jan. 31
Paper submission format Jan. 31
On-line by epapers.org
Budget plan, LOGO approved by IEEE Feb. 6
Paper electronic website open Mar. 1
Final papers submission Sep 1 Author
registration deadline Sep 1
Paper submission deadline May 31
NSC compensation deadline May 31
Final program print and distribution Sep. 15
Call for Participation Registration Form
Distribution Jun. 15
Paper review deadline Jun.20
Proceeding (hardcopy CD) publication Oct. 1
TPC meeting for paper selection and advanced
program Jul. 1
Notification of Acceptance Jul. 15
Final finance report to IEEE Dec. 31
Pre-registration Open Jul. 15
Visa request process for PRChina and other
contries Aug. 1
Interim finance report Sep. 10
49
II. Detail Plans for A-SSCC 2005

• agenda
• Technical Program Committee
• Local Conference Structure
• Conference Schedule
• Financial Plan
• Working Items Schedule
• Issues Pending

50
Issues Pending

• A-SSCC special issue in JSSC
• Industry drive

51
Agenda

• I. A-SSCC Organization Structure
• II. Detail Plans for A-SSCC 2005
• III. Plan for A-SSCC 2006

52
Working Items

• Organizing A-SSCC2006 local committees by June,
  2005
• A-SSCC2006 proposal to AdCom in Aug. 2005
• A-SSCC2006 announced in A-SSCC2005, Taiwan, Nov.
  2005

53
Supplementary
54
VLSI-TSA DAT 2005 Summary
168 submitted papers
Domestic/Foreign
Attendees by affiliation
5 invited industrial papers
55
AP-ASIC Paper Submission/Acceptance
Submitted
Accepted
2002
2004
2000
Acceptance Rate
55 (88/160) 57 (91/161) 66(95/144)
56
AP-ASIC Paper Submission Country/Track
Country
Track
2000
2002
2004
57
AP-ASIC 2004 Summary
Papers by the first author
Attendees by Country