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RF and mmWave Research

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Title: RF and mmWave Research


1
RF and mm-Wave Research
  • Ali M. Niknejad
  • Robert Brodersen
  • BWRC 2004 Summer Retreat
  • University of California at Berkeley

2
Presentation Outline
  • Research Focus
  • 60 GHz Update
  • COGUR Project
  • BSIM Update

3
Research Focus Areas (I)
COGUR
60 GHz WLAN
BSIM
Dynamic Radio Multistandard Operability Broad/Mult
i band Voice/Data Short/Long Range
Gb/s Data Rates Multi-Antenna Architecture Sub-100
nm CMOS
BSIM4 BSIM-SPP
Anti-Collision Radar
WLAN at 17/24/40 GHz
4
Research Focus Areas (II)
Organic Transistors (with Prof. Subramanian)
FinFet Devices (with Prof. King)
BSIM
Inductor/Capacitors Active Devices Oscillators/Amp
lifiers Power Harvesting
Sub 65 nm CMOS Analog Performance Microwave
Performance
BSIM-SOI BSIM-DG
Next Generation Communication Circuits
Low Cost RFID
5
60 GHz Transceiver Update
  • Chinh Doan, Sohrab Emami, David Sobel
  • Mounir Bohsali, Brian Limketkai,
  • Sayf Alalusi, Patrick McElwee

6
Why is operation at 60 GHz interesting?
57 dBm
40 dBm
  • Lots of Bandwidth!!!
  • 7 GHz of unlicensed bandwidth in the U.S. and
    Japan
  • Europe CEPT there is an urgent need to identify
    and harmonize civil requirements in the frequency
    range 5466GHz.

7
60 GHz Challenges
  • High path loss at 60 GHz (relative to 5 GHz)
  • Antenna array results in better performance at
    higher frequency because more antennas can be
    integrated in fixed area
  • Silicon substrate is lossy high Q passive
    elements difficult to realize?
  • No, the Q factor is even better at high
    frequencies with T-lines, MIM caps, and loop
    inductors (Q gt 20)
  • CMOS device performance at mm-wave frequencies
  • CMOS building blocks at 60 GHz
  • Design methodology for CMOS mm-wave
  • Low power baseband architecture for Gbps
    communication

8
60 GHz CMOS Wireless LAN System
10-100 m
  • A fully-integrated low-cost Gb/s data
    communication using 60 GHz band.
  • Employ emerging standard CMOS technology for the
    radio building blocks. Exploit electronically
    steer-able antenna array for improved gain and
    resilience to multi-path.

9
A Leap Forward for CMOS
X
Where we are now with 130 nm
  • CMOS offers two orders of magnitude cost
    reduction while providing higher integration and
    reliability
  • Each new process generation moves it 20-40
    higher

10
60 GHz Design Methodology
  • Characterize active devices
  • Small-signal models for 130 nm and 90 nm CMOS up
    to 65 GHz
  • Large-signal models (gain compression, mixing,
    power)
  • Characterize passive devices
  • transmission lines, bypass/coupling capacitors,
    varactors, chokes
  • Build library of active and passive devices
  • Use library to build and validate modeling
  • Bandpass filters, quadrature couplers
  • Verify performance of key building blocks at 60
    GHz
  • filters, amplifiers, mixers, oscillators
  • Investigate baseband architecture to process 1
    Gb/s
  • Integrate building blocks into 60 GHz front-end
  • Build integrated package antenna array (w/ VTT
    collaboration)
  • Interface to analog baseband

11
130-nm CMOS Maximum Gain
VGS 0.65 V VDS 1.2 V IDS 30 mA W/L
100x1u/0.13u
12
mm-Wave BSIM Modeling
  • Compact model with extrinsic parasitics
  • DC I-V curve matching
  • Small-signal S-params fitting
  • Large-signal verification
  • Challenges
  • Starting with a sample which is between typical
    and fast
  • Millimeter-wave large-signal measurements
  • Noise
  • 3-terminal modeling

13
DC Curve Fitting
Measured and modeled IDS vs. VDS.
Measured and modeled gm vs. VGS.
  • I-V measurements were used to extract the core
    BSIM parameters of the fabricated common-source
    NMOS.

14
Model Extraction Small-Signal
  • Extensive on-wafer S-parameter measurement to 65
    GHz over a wide bias range
  • Parasitic component values extracted using a
    hybrid optimization algorithm in Agilent IC-CAP.
  • The broadband accuracy of the model verifies that
    using lumped parasitics is suitable well into the
    mm-wave region.

15
Large-Signal Verification
  • Harmonics power measurement
  • Class AB operation
  • Large-Signal amplification at 60 GHz

16
Transmission line design of an LNA
  • How do we model these transmission lines?

17
Co-planar (CPW) and Microstrip T-Lines
  • Microstrip shields EM fields from substrate
  • CPW can realize higher Q inductors needed for
    tuning out device capacitance
  • Use CPW

18
40-GHz and 60-GHz CMOS Amplifiers
11.5-dB Gain _at_ 60 GHz
18-dB Gain _at_ 40 GHz
  • Design methodology is incredibly accurate!
  • Power consumption 36 mW (40 GHz), 54 mW (60 GHz)
  • Noise and distortion measurements in progress

19

Modeling of 60-GHz CMOS Mixer
  • Conversion-loss is better than 2 dB for PLO0 dBm
  • IF2GHz
  • 6 GHz of bandwidth

20
Combining LO and RF Signals
  • Branch line 90º coupler
  • Long lines for phase shift
  • Hi insertion loss
  • Area
  • Reducing t-line length
  • Transistors provide some free caps!

21
Couplers Simulation Results
  • Should be no problem with the doughnut and bridges

22
Published CMOS Circuits
23
Hybrid-Analog Receiver Architecture
Proposed Baseband Architecture
Clk
Clock Rec
BBI
Timing, DFE Carrier Phase, Estimators
BBI
IF
Complex DFE
ejq
BBQ
BBQ
LOIF
  • Condition the signal prior to quantization
  • Phase and timing recovery, equalization in analog
    domain
  • Greatly simplifies requirements on the ADC/VGA
    circuitry
  • Synchronization estimators in the digital domain
  • Can still use robust digital algorithms for
    synchronizaiton

24
The open questions are
  • Inexpensive packaging strategies
  • Flip-chip bonding
  • LTCC
  • Noise modeling and performance
  • Breakdown voltage and PA
  • The system design strategy to use the 7 GHz of
    bandwidth and simplify circuit requirements
  • Realizing the high level of antenna gain needed
    to provide robust links
  • Aperture antennas
  • Antenna arrays
  • On-chip antennas?

25
Conclusions
  • At 130 nm, mainstream digital CMOS is able to
    exploit the unlicensed 60-GHz band
  • Accurate device modeling is possible by extending
    RF frequency methodologies
  • A transmission-line-based circuit strategy
    provides predictable and repeatable low-loss
    impedance matching and filtering

26
COGUR Cognizant Universal Radio
  • Axel Berny
  • Gang Liu
  • Zhiming Deng
  • Nuntachai Poobuapheun

27
COGUR Design Goals
  • An agile dynamic radio cognizant of its
    environment
  • Universal operation ensures multi-standard and
    future standard compatibility
  • Cognitive behavior allows spectrum re-use,
    underlay, and overlay
  • Dynamic operation allows low power (only need
    linearity and low-phase noise VCO in a near-far
    situation)
  • Multi-mode PA can work in linear mode for OFDM
    and high PAR modulation schemes. Efficiency is
    maintained while varying output power

28
From Super-Het to Low/Zero IF Architectures
  • Today fully integrated radios are often low-IF or
    zero-IF to reduce IF SAW filters
  • Receiver front-end is often integrated in a
    single chip. PA is a separate chip or module.
    Synthesizer is often a separate chip.
  • These radio architectures are optimized for a
    specific standard (image rejection, linearity,
    filtering, bandwidth)
  • How do we integrate 5-10 such radios into one
    wireless device?

29
COGUR Transceiver
  • Broadband dynamic LNA/mixer
  • Wide tuning agile frequency synthesizer
  • Dual-mode broadband PA with integrated power
    combining and control
  • Linear VGA or attenuator
  • High-speed background calibrated ADC/DAC

30
COGUR Front End Specs
  • Frequency 800 MHz 2.5 GHz (Cellular, WLAN,
    WPAN)
  • Front-End
  • LNA S21 gt 12 dB, NF lt 3 dB, IIP3 gt 0 dBm
  • Passive Image Reject Mixer (20 dB), G gt-5 dB,
    NFlt12 dB, IIP3 gt 20 dBm
  • Baseband analog filter 40 dB blocker
    attenuation (5th order filter)
  • VGA Gain 10 70 dB, NF 5 dB, IIP3 -10 dBm,
    10 dBm
  • PA Multi-mode Class A/F, peak power 250mW/500mW
  • On-chip power combining with dynamic output power
    control and near constant efficiency at power
    back-off
  • Synthesizer
  • Frequency resolution 2.5kHz
  • Phase noise lt -116dBc/Hz at 600kHz
  • Settling time lt 150us
  • ADC
  • Resolution 10-bits
  • 200 MHz Sampling Rate
  • Background Calibrated

31
Broadband LNA Topology
  • Two Stage input matching improves bandwidth by 3x
  • Input network is a Chebychev filter
  • Filter termination provided by active device
  • Very similar to workhorse inductively degenerated
    common source amplifier
  • Noise figure optimization possible (NFmin)
  • Power match almost equal to noise match

32
Broadband LNA Covers 800 MHz 2.5 GHz
33
Dynamic LNA Performance
  • Gain gt 12 dB for bias current varying from 2 mA
    14mA
  • NF lt 3 dB for bias current varying from 2 mA 14
    mA
  • Input match better -9 dB for current varying from
    2mA 14m A

34
Wideband Fractional-N Synthesizer
  • Core VCO has a tuning range of 21 to cover
    almost any frequency band. Loop must be stable
    and low-noise over entire range.

35
Broadband VCO with Switch Caps
  • Core VCO employs switched capacitor tuning to
    cover over 1 GHz of tuning range with low Kvco
  • Digital calibration loop keeps amplitude of VCO
    fixed over entire range

36
Synthesizer Phase Noise Simulation
37
Broadband VCO Layout
  • A 1.8 GHz LC VCO
  • 1.3 GHz Tuning Range
  • Mixed-signal Amplitude Calibration
  • 0.18µm CMOS
  • phase noise of 104.7dBc/Hz at a 100kHz
  • 3.2mA from a 1.5V supply

38
TX Class A/F Dual Mode PA
  • Design a power amplifier which meets requirements
    called by the next generation wireless
    communication standards while providing backward
    compatibility with existing network
  • Integration fully integrated without any off
    chip components
  • Long talk time maintain high efficiency over
    entire output range
  • High data rate amplitude modulation requires
    high linearity

39
Distributive Active Transformer
  • Power combining major challenge of PA design
  • Caltech work has shown that DAT is promising
    candidate for fully integrated power combining
    and matching
  • Low loss transmission lines form 11 transformers
  • Distributed nature allows power/efficiency
    control

40
BSIM5 Beta is Here
  • Brief history of BSIM
  • BSIM3 Industrial standard model, regional
    threshold based model, advanced short-channel
    device physics
  • BSIM4 RF modules, improved holistic noise,
    leakage currents, non-uniform doping, stress
    effect
  • Problems with BSIM3/4
  • Models are inherently regional (sub-threshold is
    smoothly matched to strong inversion). A lot of
    short-channel effects in VTH.
  • Models are source referenced (transistor produces
    artificial discontinuity in specialized
    applications such as passive mixers)
  • Possibility of negative conductance or
    capacitance
  • BSIM5
  • New non-VTH charge-based single-equation core
    (Q-V).
  • I-V and C-V models based on Q-V core.
  • Short channel / advanced process effects included
    from BSIM4
  • Bulk referenced model. Smooth and continuous
    derivatives.

41
Acknowledgements
  • BWRC Member Companies
  • DARPA TEAM Project
  • SRC and member companies
  • STMicroelectronics and IBM for wafer processing
    and design support
  • Agilent Technologies (measurement support)
  • National Semiconductor
  • Qualcomm
  • Analog Devices
  • BSIM5 Support TI, Intel, IBM, AMD,
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