ECE%20300%20Microprocessor%20Project%20MSP%20430

1
ECE 300 Microprocessor Project MSP 430
2
Group Members

• Demetric Banahene
• David Fish
• Zack Pannell

3
Objectives

• The purpose of this project is multi-fold.
• To learn to interpret a printed circuit board
  layout.
• To learn some basic skills of making ultra-fine
  solder connections.
• To link files to form a project and compile and
  link the programs of the project.
• To learn the basics of using the debugging tool,
  C-Spy, of the IAR Software to program the board
• To select a proper temperature sensor.

4
Board Components - Chip

• The first component that was soldered onto the
  board was the MSP430 Microprocessor Chip using
  the provided Microscope.
• This was done by aligning the chip with the
  circuit traces and keeping it stable with a tiny
  bit of flux.
• There were 100 solder connections which proved to
  be difficult at first.

5
Board Components-LCD Display

• The LCD Display had 40 pins to solder.
• It was hard to line up the pins to fit in the
  slots on the board.
• The holes on the board sucked the solder down
  into board.

6
Board Components Resistor and Capacitors

• These components were placed on the board and
  held in place by a small amount of flux.
• They were then soldered down.

C1 0.1 uf C2 0.1 uf C3 10 uf (polarized) C4
0.1 uf C5 0.1 uf C6 10 uf (polarized) C9
1.0 uf C10 0.1 uf R5 47 kohms
7
Board Components- Other parts

• The components were placed on the board in the
  following order Push button switch, voltage
  regulator, 5 volt input plus, slider switch, JTAG
  connector, and finally the 32.7 kHz crystal.
• These parts were soldered onto the board.

8
Board Components Banana Jacks and Stand Offs

• Holes were drilled into the board to make room
  for the two banana jacks and four stand offs.
• The parts were then screwed in through the holes.

9
Programming the Chip

• The software given in the kit was installed.
• The files provided by Dr. Green, lcd.c, lcd.h,
  delay.c, delay.h, demo.c, sensor.c, were placed
  in a designated project folder.
• The MSP430 Flash emulation tool was connected to
  the board and the computer.
• A new project was created and the procedure in
  the project manual was followed.

10
Temperature Sensor

• The AD590LH was selected.
• Specifications
• Output Type Analog
• Sensor Output 1 µA/K
• Supply Voltage Range 4V to 30V
• Temp Range(s) -55 to 150

AD590 Pin Diagram
11
Temperature Sensor

• The temperature sensor circuit was built using
  the following
• AD590LH temperature sensor
• 1000 ohm potentiometer
• 100 ohm potentiometer
• 1000 ohm resistor
• LM741 Op Amp
• 10,000 ohm resistor
• 1800 ohm resistor
• 2 9-Volt Batteries

12
Calibrating the Sensor

• The 100 ohm potentiometer was adjusted until the
  output was (273 C) mV
• The 1000 ohm potentiometer was adjusted until the
  circuit produced a gain of 5.

13
Programming the Board

• The files lcd.c, delay.c, sensor.c were compiled
  and flashed to the board.
• The banana jacks were connected from the sensor
  to the board.
• The temperature was then displayed on the LCD
  screen in both Fahrenheit and Celsius.

14
Temperature Sensor

• The temperature sensor took approximately 8
  cycles (40 seconds) to settle to the correct
  temperature.
• This can be seen in the graph to the right.

15
What we learned

• How to solder
• How to use a microscope to make ultra-fine solder
  connections
• Circuit troubleshooting
• How to use the IAR Systems tools
• Patience
• A basic understanding, at a first level, on how
  several aspects of engineering are brought
  together to form a useful system

16
The Completed Board and Sensor