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Title: The global wafer level packaging market size was valued at $4.5 billion in 2020, and is projected to reach $23.6 billion by 2030, growing at a CAGR of 18.8% from 2021 to 2030. - PowerPoint PPT Presentation
Description: Wafer level packaging (WLP) is a method of attaching packaging components to an integrated circuit (IC) prior to dicing the wafer. This procedure varies from a traditional method, which involve slicing the wafer into separate circuits (dice) before attaching the packaging components. – PowerPoint PPT presentation
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